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The DGS-3324SR blends many features typically found in more expensive chassis based solutions (high density, hot swap, redundant power options, and high performance) with the price and flexibility of a stackable.
The D-Link xStack 48-Port Gigabit Managed Stackable Layer 3 Switch (DXS-3350SR) and the D-Link xStack 24-Port Gigabit Managed Stackable Layer 3 Switch (DXS-3326GSR) will be available in Q3, 2004 through authorized reseller and distribution partners at a Manufacturer's Suggested Price MSRP of $4799 and $3699 respectively.
So if flexibility isn't the key, why go for this stackable design at all?
If it comes to choosing between stackable spiral mandrels or discs, Gates says the spirals provide superior mixing and distribution when compared with discs found on other modular dies.
Battenfeld Gloucester has married the center-feed approach of traditional dies with the modularity of stackable mandrels.
Another stackable design will be forthcoming from Alpine American, according to general manager David Nunes.
None of the suppliers, for instance, promotes oscillating stackable dies.
At Davis-Standard, stackable dies are considered appropriate for three-layer applications only when individual layers must run at low output--for instance, when "skinning a material" with a 3/94/3% split.
Given some of the drawbacks, where do stackable dies fit in?