References in periodicals archive ?
This bump is dangerous and causes too many accidents as drivers coming both ways veer into traffic to avoid the bump.
Seven patients who were "speed bump positive" did not have appendicitis but did have other significant problems such as ruptured ovarian cyst or diverticulitis (bulging sacs or pouches most commonly found in the large intestine).
In the end, we felt to have a 15,000-square-foot parking lot serving all the buildings we own downtown made more sense," Bumps said.
I paid pounds 50 to have the tracking done on my car and when I asked for a guarantee was told they he couldn't give me one as the first speed bump I went over could knock it out of alignment again.
Boning up on process engineering skills such as using test-compatible solder paste to minimized flux residue, and working with the bare board manufacturer to keep solder mask opening tolerances, will ease soldered bump implementation.
Road bumps were introduced in 1991 and are no strangers to controversy.
Speed bumps can also cause structural damage - as the impact of vehicles going over the bump sends shockwaves through the ground.
Surely there is not a need for bumps on nearly every back street in Liverpool?
It works by lowering the bump for drivers who obey the speed limit.
Why on earth would I put on ski boards and head out onto bumps and moguls, the most difficult area of any mountain?
First, layout designers need to spend additional time counting bends and planning the placement of compensation bumps nearby.
In addition to the gold bump solution, other alternatives include a conductive epoxy bump, copper bumps, column-shaped bumps and even spring-type connections.
As fog wafts by, tiny water droplets gather on the top of a bump, merging into a drop big enough for the wind to nudge off the bump's summit.
Thinking the bump had been accidental, Pimentel got off the freeway, but the truck followed and bumped his vehicle a second time, he told deputies.
The NSX Series is a flexible solution for 100% inspection of gold bumps, solder bumps both pre- and post-reflow, Under Bump Metal (UBM), in addition to active die area of whole wafers, sawn wafers on film frames and discrete die.