The qualification of our 10nm ultra-high density wafer bumping
technology is a recognition of our capabilities and strengths from Qualcomm Technologies, and is expected to further drive our techniques to a higher level.
An apartment community using one lock format and re-keying units at each move out could be at greater risk for bumping
because of the number of keys fitting the channel that are circulating in the public.
Instead the discussion will be on gold bumping
and the connection process.
Flip Chip Technologies, a joint venture of Kulicke & Soffa Industries and Delphi Delco Electronics Systems, based in Phoenix, Arizona, is an innovative, high-volume wafer bumping
resource providing IC packaging services and expertise to the semiconductor industry.
The new floor space's clean room has been completed and installation of some of the new bumping
equipment started in June.
Sampus Yang, Vice President at Chipmore stated: Chipmore offers a range of bumping
solutions for our global customers, ranging from high-end gold bumping
to cost-effective copper bumping
for flip chip packaging.
We are excited to come together to offer our customers around the world more choices and flexibility for their wafer bumping
This Frost & Sullivan research service entitled SMT Opportunities in Back-end Semiconductor Markets provides in-depth information on the placement, inspection, soldering and dispensing equipment opportunities with complete analysis of key market opportunities, challenges and restraints along with analysis of back-end packaging, bumping
and die attach trends.
Nasdaq: AMKR) today announced that AMD has entered into an agreement to license Amkor's lead free (Pb-free) electroplated wafer bumping
Amkor has selected SUSS lithography systems to commence its' wafer bumping
service in Singapore to support emerging applications on 300mm wafers.
The new bumping
facility, located at 2 Science Park Drive, will have an initial capacity of 8,000 wafers per month, with the potential to reach 30,000 wafers per month in the coming years.
The availability of a commercial source for high quality glass molds is one of the critical aspects of this new bumping
technology" states Dr.
BOC has partnered with Shinko Seiki, a leading supplier of plasma and vacuum soldering systems in Japan, to assist chip manufacturers with void-free and flux-free advanced solder bumping
Thick resist processing is an enabling technology for volume production in wafer level packaging and solder bumping
, which represent the two main markets for both companies.
Our customer is the clear leader in wafer bumping
technology, having licensed its industry-standard and advanced bumping
processes to the semiconductor industry's packaging heavyweights throughout the world.