bond

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(one's) word is (one's) bond

One always keeps one's promises. I promise that I'll be there in time with the money for the deposit: my word is my bond.
See also: bond, word

one's word is one's bond

Fig. one's statement of agreement is as sound as a posting of a performance bond. Of course, you can trust anything I agree to verbally. My word is my bond. There's no need to get it in writing.
See also: bond, word

someone's word is their bond

someone keeps their promises.
A variant of this expression, now rather dated, is an Englishman's word is his bond .
See also: bond, word

your, his, etc. ˌword is (as ˌgood as) your, his, etc. ˈbond

used to say that somebody always does what they promise to do: Don’t worry, you can trust my brother. His word’s as good as his bond.
See also: bond, word

junk bond

n. a low-rated corporate bond that pays higher interest because of greater risk. (Parallel to junk food.) Don’t put all your money into junk bonds.
See also: bond, junk
References in periodicals archive ?
La tesis principal de Bonder afirma que el cuerpo es el motivo fundamental de nuestras acciones y de nuestros comportamientos que ocultamos en las vestimentas de nuestros simbolos y cultura.
Her friend Anne DuPont says Bonder told her in July 1997 that she had been having sex with Bing for weeks.
The 5K B series motorized z wire bonders are state-of-the-art manual ball and wedge bonders applying the most advanced machine/operator interface possible in a manual wire bonder.
10% higher UPH (Units Per Hour) over the first generation ConnX ball bonder.
Loctite Universal Structural Bonders are designed to reach beyond conventional approaches, and help tackle the most challenging repair situations.
A typical high-speed ball bonder will offer only a 4 sq.
introduced its fully integrated DVD replication unit, called the "Mars" system, which combines two injection machines, a sputtering unit, two overcoaters, and a uv cationic bonder into a single line.
Palomar Technologies (formerly part of Hughes Aircraft Company) is the world's foremost supplier of automated high-precision wire bonders, die bonders and component placement systems combined with process development and contract assembly services to increase yield and lower costs for microelectronic device manufacturers.
Designed to deliver excellent performance with multiple substrates, from extreme temperatures to high vibration, Loctite HY 4090 and Loctite HY 4080 GY Universal Structural Bonders greatly expand the capabilities of traditional adhesives and offer versatile solutions for challenging applications.
The CB8 semi-automated 200mm wafer bonder recently installed at MST.
Description of area of research and use of equipment: The new flip chip bonder is to be used in the University of Arkansas High Density Electronics Center assembly lab.
The Model 850 flip chip bonder is designed for flip chips, chip-scale devices and bare die used in entry level, low-volume production and development project environments requiring accuracies of plus/minus 12 micron.
based in Vermont, is the Bonder Division headquarters and North American sales and service site for all SUSS products.
For a smooth transition from the lab or low-volume production to full production recipes developed on the CB8, semi-automated wafer bonder, can easily be transferred to the CBC200, multi-chamber cluster tools.