substrate will impact more than 16% of the traditionally organic-made' IC package substrate business by 2017, with almost $1.
AMD's GPU and stacked HBM dies are placed on top of UMC's interposer
that employs a TSV process.
Iyer spoke of the value that the silicon interposer
offers where decoupling capacitors can be integrated into the thin film layers on the silicon substrate.
Substrate warpage as an assembly issue for flip chip on organic interposers
and silicon interposers
was an important topic discussed across many sessions as an assembly issue for flip chip on organic interposers
and silicon interposers
AGC has developed carrier glass technology that enables its customers to handle ultra-thin glass at their sites and micro-hole drilling technology to manufacture ultra-thin glass interposers
technology is more than a bridge technology; it is a vital component for heterogeneous system integration.
The LeCroy Mini Card interposer
supports probing at speeds up to 5 GT/s (Gen2).
The test solutions are comprised of the Agilent 16962A logic analyser module and either a Nexus NT-DDR3DIHS or Nexus NT-DDR3SOIHS slot interposer
for next-generation, double-data rate (DDR3) SDRAM buses.
At DesignCon 2013, Rambus engineers and scientists will present six technical papers on topics such as: mixed signal designs, 3D interposer
design, memory controllers and 3D DRAM, high-speed coded differential signaling, and high-speed parallel buses.
While the interposer
sessions were not as packed as in past years, attendees heard the latest developments in silicon and glass interposer
fabrication, and several exciting advances were revealed.
At the workshop on Global Interposer
Technology held at Georgia Tech in November, companies debated the future of interposers
needs many holes with a diameter of about 50 micrometers to connect through-electrodes of semiconductors.
1 pure silicon foundry, will begin next year offering 28nm 3D process technologies including silicon interposer
, bump on trace (BOT) and through silicon via (TSV) to vie for contracts for making processors based on ARM-developed architecture.
Options include camera alignment modules, Kapton or silicon interposer
feeders, water-cooling and fume extraction.
NEC Electronics and NEC developed the SMAFTI technology by leveraging three key enabling technologies: a 50-micron-pitch microbump interconnection technology, a 15-micron-thick feed-through interposer
(FTI) based on superconnect technology, and a multichip assembly process.