bumping


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Related to bumping: bumping into

bumping

1. mod. [of music] having a good beat. Man, this music is bumping. I can feel the beat.
2. mod. crowded and busy. This place is bumping. Let’s sit in the corner, out of the way.
3. mod. really good; cool. We had a bumping time at Tiff’s last night.
See also: bump
References in periodicals archive ?
Average bump height measurements and standard deviations for each die on a single wafer can be plotted as a surface showing characteristic bumping process variation across a wafer.
Bumpelina practiced the bumping noises she would make tomorrow.
KUALA LUMPUR, Malaysia -- Unisem Advanced Technologies (UAT) announced today that it is expanding wafer bumping capacity in its factory in Ipoh, Malaysia.
Instead, Flip-Chip is keeping up with the times and developing new bumping solutions to serve the most advanced technologies, like 3DIC and 2.
Probing before bumping was found to accelerate the drift in resistance.
23 /PRNewswire/ -- FlipChip International, LLC today announced the successful demonstration of 95 micron pitch bumping technology for advanced semiconductor devices at its R&D laboratory in Phoenix, Arizona.
IC Interconnect (ICI), a wafer bumping service company, announces an agreement with Jiangyin Changdian Advanced Packaging (JCAP), a company specializing in solder bump, gold bump and pillar bump mass production.
Chipbond intends to use the Ultratech system to perform gold bumping on 6- and 8-inch wafers for a wide range of display-driver devices.
This Frost & Sullivan research service entitled SMT Opportunities in Back-end Semiconductor Markets provides in-depth information on the placement, inspection, soldering and dispensing equipment opportunities with complete analysis of key market opportunities, challenges and restraints along with analysis of back-end packaging, bumping and die attach trends.
Wafer bumping is a rapidly growing segment of the semiconductor industry.
Nasdaq: AMKR) today announced that AMD has entered into an agreement to license Amkor's lead free (Pb-free) electroplated wafer bumping technology.
The system includes full SPC capabilities, making the WS-2000 a powerful tool for controlling the bumping process.
Amkor has selected SUSS lithography systems to commence its' wafer bumping service in Singapore to support emerging applications on 300mm wafers.
If the airline does overbook your flight, Department of Transportation rules require that the airline ask for volunteers for bumping (compensated by cash or a free ticket).