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one's word is one's bond

Fig. one's statement of agreement is as sound as a posting of a performance bond. Of course, you can trust anything I agree to verbally. My word is my bond. There's no need to get it in writing.
See also: bond, word

junk bond

n. a low-rated corporate bond that pays higher interest because of greater risk. (Parallel to junk food.) Don’t put all your money into junk bonds.
See also: bond, junk
References in periodicals archive ?
Her friend Anne DuPont says Bonder told her in July 1997 that she had been having sex with Bing for weeks.
In recent years, K&S has expanded its product offerings through strategic acquisitions, adding die and wedge bonders and a broader range of expendable tools to its core ball bonding products.
introduced its fully integrated DVD replication unit, called the "Mars" system, which combines two injection machines, a sputtering unit, two overcoaters, and a uv cationic bonder into a single line.
With the trend for 200mm MEMS manufacturers to move to MEMS foundries utilizing advanced metal bond technologies we are very pleased to be accepted as the supplier of choice for bonders to help MEMS manufacturers achieve significant size and cost reduction for their devices" said Wilfried Bair, General Manager of the bonder division, SUSS MicroTec, "We see MST.
The 8000i Wire Bonder was showcased at the Palomar Asia office grand opening event, held on Friday, August 2.
Palomar's Model 6500 precision automated assembly work cell and Model 8000 high-speed automated gold wire bonder automate the assembly of TOSA/ROSA protocol-independent CWDM-based optical sub-assemblies.
July 3, 2012 /PRNewswire-iReach/ -- Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the company will be exhibiting live demonstrations on the 3800 Die Bonder and 8000 Wire Bonder at SEMICON West 2012, July 10-12 in San Francisco, CA, in booth #6157.
The reduced footprints of semiconductor packages have made accuracy imperative in chip bonder machines and this development fuels growth in the chip bonder market.
We are able to support[application dependent] requirements for ultra-high placement accuracies on our eutectic/epoxy 3800 Die Bonder and 6500 Die Bonder systems.
The new IConn(PS) wire bonder replaces the current market-leading Maxum Ultra wire bonder.
With the growing installed base of 3800 Die Bonder customers and the long-standing presence of the 8000 Wire Bonder across the APAC region, Palomar Technologies has successfully expanded the Palomar Asia Spare Parts Depot and regional customer services infrastructure.
Palomar Technologies, provider of precision automation equipment, process development, and assembly services for microelectronic assembly, announces it has received the 2007 Advanced Packaging Award in the wire bonding equipment category for the use of its Model 8000 ball bonder to emulate certain wedge bonding applications.
Palomar Technoloiges will exhibit at SMT Nuremberg 2012, May 8-10, with live wire bonder demonstrations.
Wedge emulation uses Palomar Technologies' Model 8000 ball bonder to maximize the bonding speed, reliability, and reduced keep-out space of a ball bonder for high density packages that previously required a wedge bonder.