Her friend Anne DuPont says Bonder
told her in July 1997 that she had been having sex with Bing for weeks.
In recent years, K&S has expanded its product offerings through strategic acquisitions, adding die and wedge bonders
and a broader range of expendable tools to its core ball bonding products.
Another consideration that may affect the choice of a bonder
is its ability to stack components.
introduced its fully integrated DVD replication unit, called the "Mars" system, which combines two injection machines, a sputtering unit, two overcoaters, and a uv cationic bonder
into a single line.
With the trend for 200mm MEMS manufacturers to move to MEMS foundries utilizing advanced metal bond technologies we are very pleased to be accepted as the supplier of choice for bonders
to help MEMS manufacturers achieve significant size and cost reduction for their devices" said Wilfried Bair, General Manager of the bonder
division, SUSS MicroTec, "We see MST.
The 8000i Wire Bonder
was showcased at the Palomar Asia office grand opening event, held on Friday, August 2.
Palomar's Model 6500 precision automated assembly work cell and Model 8000 high-speed automated gold wire bonder
automate the assembly of TOSA/ROSA protocol-independent CWDM-based optical sub-assemblies.
July 3, 2012 /PRNewswire-iReach/ -- Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the company will be exhibiting live demonstrations on the 3800 Die Bonder
and 8000 Wire Bonder
at SEMICON West 2012, July 10-12 in San Francisco, CA, in booth #6157.
The reduced footprints of semiconductor packages have made accuracy imperative in chip bonder
machines and this development fuels growth in the chip bonder
We are able to support[application dependent] requirements for ultra-high placement accuracies on our eutectic/epoxy 3800 Die Bonder
and 6500 Die Bonder
The new IConn(PS) wire bonder
replaces the current market-leading Maxum Ultra wire bonder
With the growing installed base of 3800 Die Bonder
customers and the long-standing presence of the 8000 Wire Bonder
across the APAC region, Palomar Technologies has successfully expanded the Palomar Asia Spare Parts Depot and regional customer services infrastructure.
Palomar Technologies, provider of precision automation equipment, process development, and assembly services for microelectronic assembly, announces it has received the 2007 Advanced Packaging Award in the wire bonding equipment category for the use of its Model 8000 ball bonder
to emulate certain wedge bonding applications.
Palomar Technoloiges will exhibit at SMT Nuremberg 2012, May 8-10, with live wire bonder
Wedge emulation uses Palomar Technologies' Model 8000 ball bonder
to maximize the bonding speed, reliability, and reduced keep-out space of a ball bonder
for high density packages that previously required a wedge bonder